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XCVE1752-1MSIVSVA2197

Part number XCVE1752-1MSIVSVA2197
Product classification System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSAL AI-CORE FPGA 2197BGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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$22,475.2500

$22,475.2500

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TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case2197-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Edge FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package2197-FCBGA (45x45)
ArchitectureMPU, FPGA

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Roving Networks (Microchip Technology)
IC EEPROM 1KBIT MICROWIRE 8SOIC
Omron Electronic Components
SENSOR OPT REFLECTIVE 5MM 5DIP
Panasonic Electronic Components
RES 68 OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 560 OHM 5% 3W AXIAL
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